The present invention provides a pressure-sensitive adhesive tape production line with a pressure-sensitive bonding device, characterized by: the pressure-sensitive workbench is placed on the ground, with a pressure-sensitive six-sided box fixed to the pressure-sensitive table plate. One end is equipped with a pressure-sensitive guide frame, and an upper pressure-sensitive six-sided frame is installed, containing an intermediate flat rectangular frame. The glue application guidance device is mounted on the intermediate flat rectangular frame of the pressure-sensitive six-sided frame of the pressure-sensitive workbench. The top surface of the glue dropper plate is fitted with a glue dropper pump and a glue dropper tank. The drying device is installed on the pressure-sensitive table plate of the pressure-sensitive six-sided box of the pressure-sensitive workbench, with the drying box positioned near the glue application device in the middle of the pressure-sensitive six-sided box. The pressing device is mounted on the intermediate flat rectangular frame of the pressure-sensitive six-sided frame of the pressure-sensitive workbench, located on the side of the drying device opposite the glue application device, away from the pressure-sensitive six-sided box's upper surface. The traction and cutting device is installed on the pressure-sensitive table plate of the pressure-sensitive six-sided box of the pressure-sensitive workbench, positioned at the end of the pressure-sensitive six-sided box opposite the pressure-sensitive guide frame. The present invention offers high efficiency in glue application and pressing, accurate cutting, and minimal labor requirements.
